mail: info@aoipcb.com

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Technology

The information below details some of the key capabilities that AOI can offer and support today. You will find information here relating to the specific materials we can support, the printed circuit boards technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.

 

The first category is what we call “standard” and means we can offer each individual parameters from multiple sources. The second is our “advanced” offering and this shows the very best that AOI can offer, but here the supply chain or sourcing options is limited and in some cases this means that only one plant is capable of this parameter. When using combinations of these parameters, you should always consult your local AOI technical contact person.

Featured

Standart

Advanced

Materials

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Minimum dielectric thickness

 

 

Layer count

 

HDI (build up)

Laser drilling blind via (Y/N)

Copper filled blind via (Y/N)

Epoxy resin filled PTH (Y/N)

Capped via (Y/N)

Back drilling (Y/N)

 

Maximum board size (mm)

 

 

Minimum board thickness (mm)2L

 

 

Minimum board thickness (mm)≥4L

 

Maximum board thickness (mm)

Minimum track / gap IL (mil)

Minimum track / gap OL (mil)

 

Surface finish

 

 

 

Minimum hole (mech) (mm/mil)

Minimum hole (laser) (mm/mil)

 

Aspect ratio PTH

 

 

Aspect ration blind via

Finish hole tolerance (PTH)

Finish hole tolerance (NPTH)

Maximum Cu weight OL

Maximum Cu weight IL

Impedance control (+/- X%)

Embedded components (Y/N)

RIGID: FR2, CEM-1, CEM-3, FR4(standard, halogen free, high performance)

including: ShengYi, ITEQ, Elite Materials Corp., NanYa, Kingboard, Grace, TUC.

 

FLEX: PI, PET

including: Taiflex, Dupont FR & AP, Panasonic, ShengYi.

 

MC PCB: Al based

including: Bergquist MP, HT & CML; ITEQ; Laird T-Lam, TLAM SS; Totking T-100, T-300.

​

RFID Inlays: Em-Marine, Mifare 1K, Mifare Plus S2k, Mifare Ultralight, etc.

 

Please contact AOI for full details regarding material availability.

​

 

0.100mm for PCB

0.025mm for FPC

 

1-34L for PCB

1-4L for FPC

1-N-1

Y

N

N

Y

N

 

620.00 x 813.00 for PCB

240.00 x 360.00 for FPC

 

0.30 for PCB

0.12 for FPC

 

0.60 for PCB

0.20 for FPC

6.0

0.100/0.100mm (for foil 1oz)

0.100/0.125mm (for foil 1/2oz)

 

HASL (lead), HASL (Leadfree), ENIG, Gold Fingers+HASL.

 

 

 

0.25mm

0.09mm

 

8:1 for PCB

12:1 for Back Plane

 

0.8:1

± 0.075mm

± 0.050mm

6oz

9oz

50Ohm, 60Ohm, 100 Ohm (± 10%)

N

RIGID: FR4, High Tg FR4, RCC, PTFE, APPE, Ceramic

including: TUC TU862HF, TU872SLK; EMC EM370D, EM-828, EM888,; ITEQ IT150DA, IT-170GRA, IT-180A; Panasonic Megtron-2, Megtron-4, Megtron-6; Nelco N4000-13, N7000, N8000, NH9000; Isola FR408, I-Speed, I-Tera; Rogers RO4350B, RO3000; Arlon RF-35, TLX, AD250.

 

FLEX: PI, LCP

including: Dupont

 

MC PCB: Al & Cu based

including: Bergquist HPL; Ventec VT; Arlon ML99, ML92; Totking T-200, T-300, T-500.

 

Please contact AOI for full details regarding material availability.

 

0.050mm for PCB

0.015mm for FPC

 

50L for PCB

16L for FPC

1-1-N-1-1, 2-N-2, 3-N-3

Y

Y

Y (copper paste)

Y

Y

 

850.00 x 1000.00 for PCB

320.00 x 500.00 for FPC

 

0.20 for PCB

0.10 for FPC

 

0.40 for PCB

0.16 for FCP

10.0

0.075/0.075mm (for foil 1/2oz)

0.075/0.085mm (for foil 1/3oz)

 

HASL (lead), HASL (Leadfree), ENIG, ENEPIG, Immersion Ag, Immersion Sn, Soft Gold, Hard Gold, OSP, Gold Fingers+HASL, Gold Fingers+OSP.

 

0.15mm

0.05mm

 

12:1 for PCB

16:1 for Back Plane

 

1.1:1

± 0.075mm

± 0.050mm

10oz

9oz

On customer's requirement (± 5%)

Y

It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – when using combinations of these parameters, you should always consult your local AOI technical contact person.